Zing Semiconductor is a high-tech company providing high quality 300 mm silicon wafers for IC chip manufacturing industry. The main products are 300 mm polished wafer, epitaxy wafer and test wafer. The products are usually widely used as silicon substrates for integrated circuit industries such as memory chips, logic and analog, IGBT power devices and mobile computing communication chips. It is currently the first company in China to undertake major national science and technology projects in the field of 300 mm silicon wafers, and also takes the lead in achieving mass production of 300mm silicon wafers.
Zing insists on R&D innovation to promote growth, and actively responds to the national strategy of integrated circuit industry. It is commmited to researching and developing high-volume manufacturing processes of 300mm single crystal silicon wafers applied in 40-28 nm and higher technology nodes, including crystal growing, wafering preparation, epitaxy deposing and related metrologies. We will build a production base of 300 mm semiconductor silicon wafers, realize the localization of 300 mm semiconductor silicon wafers, and provide excellent wafer products for global customers.
|Company Name||Zing Semiconductor Corporation|
|Registered Address||Room C1350, Building 24, No. 2, Xin Cheng Road, Nicheng, Pudong New Area.|
|Factory Location||No.1000, Yunshui Road, Nicheng Town,Pudong New Area, Shanghai|
|Establishment Date||June 4, 2014|
|Business Scope||R & D, production and sales of high-quality semiconductor silicon wafers, import and export of goods and technologies|
|Total Investment||About 6.8 billion yuan after the completion of the third phase|
|Employee||800 employees (expected by the end of 2019)|
|Factory occupies||about 150 mu|